CAMP KILOWATT | June 8-11
A fun, unique and electrifying camp experience designed for students entering seventh grade in 2022. Horseback riding, canoeing, zip lining, archery, swimming, learning about electrical safety and bucket truck rides.
APPLY: Go to clarkremc.coop/camp to apply. Applications must be completed online by Feb. 18.
INDIANA YOUTH TOUR | June 16-23
Clark County REMC wants to send you on a weeklong, all-inclusive trip of a lifetime to Washington, D.C. Visit monuments, museums, legislators, make new friends, and learn about our nation’s history.
APPLY: Go to clarkremc.coop/youth-tour to apply. Applications must be completed online by Feb. 18.
COOPERATIVE CALENDAR OF STUDENT ART CONTEST 2023
Since 1998, Indiana Connection and participating Indiana electric cooperatives have held an annual art contest for Indiana students in grades kindergarten through 12. The winning works from each grade are then used to illustrate the Cooperative Calendar of Student Art that participating REMCs/RECs have distributed.
ENTER: Visit indianaconnection.org/for-youth/art-contest/. Enter your artwork by March 18.
CLARK COUNTY REMC SCHOLARSHIPS
Clark County REMC assists our members pursuing higher education by awarding scholarships to graduating seniors.
$1,000 scholarship for IUS, Ivy Tech Community College, and Purdue Polytechnic:
Clark County REMC is committed to helping college-bound students in our region. Each year, REMC offers 20 $1,000 scholarships to Indiana University Southeast, Ivy Tech Community College of Sellersburg and Purdue Polytechnic New Albany. Make sure to take advantage of this opportunity for your student!
The Cindy Hockensmith Memorial Scholarship:
In 2019, Clark County REMC created The Cindy Hockensmith Memorial Scholarship in the amount of $2,500 that will be awarded to one high school senior annually. The recipient of this scholarship must attend as a full-time student to any Indiana college or university.
APPLY: Download an application at clarkremc.coop/scholarships. Applications are due by March 4.
